High density Interconnection (HDI)
Multi Layer board
MCPCB
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High density Interconnection (HDI)
High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB).
Multi Layer board
Product functionality depends on the interconnection between the layers that it is made up of. Without microvia production improvements, manufacturers are forced to increase product size to improve performance.
MCPCB
As Metal Core PCB means the base material for PCB is metal, but not normal FR4/CEM1-3, etc, and currently what the metal used are Aluminum, Copper alloy. MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components.
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